異質(zhì)集成氮化鎵功率模塊的量產(chǎn)制造工藝研究A Fabrication Process for Heterogeneous Integrated GaN Power Modules王文博甬江實驗室研究員WANG WenboProfessor of Yongjiang Laboratory (Y-Lab)
Condura.ultraTM無銀AMB氮化硅基板---車規(guī)級功率模塊用高性價比解決方案Condura.ultraTM silver free AMB --- cost-effective solution for automotive power module張靖賀利氏電子中國區(qū)研發(fā)總監(jiān)ZHANG JingDirector of Innovation China, Heraeus Electronics
用于先進SiC功率模塊的整體解決（核心設備/材料/工程）方案Overall solution (core equipment/materials/engineering) for advanced SiC power module周鑫蘇州博湃半導體技術(shù)有限公司市場銷售總監(jiān)ZHOU XinDirector of Sales Marketing, Suzhou Bopai Semiconductor Technology Co., Ltd.
