面向Micro-LED封裝的先進半導體鍵合集成技術Advanced Semiconductor Bonding Technology for Micro-LED Integration母鳳文北京青禾晶元半導體科技有限責任公司董事長兼總經(jīng)理MU FengwenPresident and General Manager of Innovative Semiconductor Substrate Technology co., Ltd.
Light-extraction efficiency and performance of transparent ultraviolet C-band light-emitting diodes張劍平美國Bolb Inc.董事長兼首席技術官ZHANG JianpingChair of the BoardCTO of Bolb Inc., USA
